For electronic and space applications requiring low outgassing and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for environmental protection of electronic assemblies and components
Especially useful where moderate thixotropy is required
PROPERTIES
Typical Properties
Average Result
Uncured:
Flow, Part A (0.250" plunge for 40 seconds)
0.3 inches (0.76 cm)
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity
1.06
Durometer, Type A
40
Tensile Strength
800 psi (5.5 MPa)
Elongation
200%
Collected Volatile Condensable Material (CVCM)
0.01%
Total Mass Loss (TML)
0.11%
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
