Thermally Conductive Controlled Volatility RTV Silicone
DESCRIPTION
Two-part, white, thermally conductive silicone
Cures with the addition of heat
20:1 Mix Ratio (Part A: Part B)
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
APPLICATION
For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance, Part A
White
Work Time
2 hours
Cured: 4 hours at 65°C (149°F)
Specific Gravity
1.27
Durometer, Type A
60
Tensile Strength
425 psi (2.9 MPa)
Elongation
250%
Tear Strength
50 ppi (8.8 kN/m)
Lap Shear Strength (primed w/ CF1-135)
275 psi (1.9 MPa)
Thermal Conductivity
0.640 W/(mK)(15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
0.01%
Total Mass Loss (TML)
0.03%
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
