For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Viscosity, Part A*
900,000 cP (900,000 mPas)
Tack-Free Time*
4 hours
Work Time*
2 hours
Cured: 4 hours at 65°C (149°F)
Specific Gravity*
1.45
Durometer, Type A*
75
Tensile Strength*
250 psi (1.7 MPa)
Elongation*
60%
Tear Strength*
55 ppi (9.7 kN/m)
Moisture Absorption, % gain after 168 hour exposure 85°C at (185°F) / 85% R.H.
0.03%
Dynamic Mechanical Analysis (DMA)
See PDF Profile For Graph
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.03%
Cured: 30 minutes at 150°C (302°F)
Thermal Conductivity*
1.11 W/(mK)(26 x 10-4 cal/(cm sec°C))
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
