Polymer Systems
Technology Limited

Advanced Engineering



Thermally Conductive

Thermally Conductive Controlled Volatility Silicone

  • Two-part, white, thermally conductive silicone
  • Will cure with the addition of heat
  • 10: 1 Mix Ratio (Part A: Part B)
  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material
Typical PropertiesAverage Result
Viscosity, Part A*900,000 cP (900,000 mPas)
Tack-Free Time*4 hours
Work Time*2 hours
Cured: 4 hours at 65°C (149°F)
Specific Gravity*1.45
Durometer, Type A*75
Tensile Strength*250 psi (1.7 MPa)
Tear Strength*55 ppi (9.7 kN/m)
Moisture Absorption, % gain after 168 hour exposure 85°C at (185°F) / 85% R.H.0.03%
Dynamic Mechanical Analysis (DMA)See PDF Profile For Graph
Collected Volatile Condensable Material (CVCM)*0.01%
Total Mass Loss (TML)*0.03%
Cured: 30 minutes at 150°C (302°F)
Thermal Conductivity*1.11 W/(mK)(26 x 10-4 cal/(cm sec°C))

*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Recommended Primer CF1-135

Note: Some bonding applications may require the use of a primer.


100 Gram Kit
250 Gram Kit
500 Gram Kit


12 Months

Product Profile - Full Details Product Profile
Safety Data Sheet Material Safety Data Sheet


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