For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Viscosity, Part A*
900,000 cP (900,000 mPas)
Tack-Free Time*
4 hours
Work Time*
2 hours
Cured: 4 hours at 65°C (149°F)
Specific Gravity*
1.45
Durometer, Type A*
75
Tensile Strength*
250 psi (1.7 MPa)
Elongation*
60%
Tear Strength*
55 ppi (9.7 kN/m)
Moisture Absorption, % gain after 168 hour exposure 85°C at (185°F) / 85% R.H.
0.03%
Dynamic Mechanical Analysis (DMA)
See PDF Profile For Graph
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.03%
Cured: 30 minutes at 150°C (302°F)
Thermal Conductivity*
1.11 W/(mK)(26 x 10-4 cal/(cm sec°C))
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Packaging
100 Gram Kit
250 Gram Kit
500 Gram Kit
Warranty
12 Months
Product Profile
Material Safety Data Sheet EU EN
Biomaterials
Biomaterials - Medical Silicones for Healthcare
Advanced Technologies
Space - Aviation Grade Industrial & Engineering Silicones
Tubing
Food, Medical & Industrial Quality Silicone Tubing
Equipment
Mixing Dispensing & Degassing Equipment for Silicone
Product Profile
