For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
White
Viscosity, within 15 minutes of catalyzation
36,000 cP (36,000 mPas)
Viscosity, 2 hours after catalyzation
50,000 cP (50,000 mPas)
Tack-Free Time
13 hours
Cured: 15 minutes at 150°C (302°F)
Specific Gravity
2.34
Durometer, Type A
65
Tensile Strength
180 psi (1.2 MPa)
Elongation
50%
Lap Shear Strength (primed with SP-270)
120 psi (0.8 MPa)
Thermal Conductivity
0.95 W/(mK)(23 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
0.07%
Total Mass Loss (TML)
0.02%
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
