Designed to allow bond line thicknesses ≤ 50 microns
20:1 Mix Ratio (Part A:Part B)
APPLICATION
For applications requiring low outgassing and minimal volatilecondensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
TYPICAL PROPERTIES
AVERAGE RESULT
Uncured:
Appearance
White
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)
140 g/min
Work Time
3 hours
Cured: 30 minutes at 150°C (302°F)
Durometer, Type A
55
Tensile Strength
400 psi (2.75 MPa)
Elongation
225%
Tear Strength
55 ppi (9.7 kN/m)
Thermal Conductivity
0.644 W/(mK)(15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
0.01%
Total Mass Loss (TML)
0.04%
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
