Polymer Systems
Technology Limited

Advanced Engineering

Space:

CV2-2946

Thermally Conductive

Thermally Conductive Controlled Volatility Silicone

DESCRIPTION

Two-part, white, thermally conductive silicone
Cures with the addition of heat
Designed to allow bond line thicknesses ≤ 50 microns
20:1 Mix Ratio (Part A:Part B)

APPLICATION

For applications requiring low outgassing and minimal volatilecondensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material

PROPERTIES
TYPICAL PROPERTIES	AVERAGE RESULT
Uncured:
Appearance	White
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)	140 g/min
Work Time	3 hours
Cured: 30 minutes at 150°C (302°F)
Durometer, Type A	55
Tensile Strength	400 psi (2.75 MPa)
Elongation	225%
Tear Strength	55 ppi (9.7 kN/m)
Thermal Conductivity	0.644 W/(mK)(15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)	0.01%
Total Mass Loss (TML)	0.04%

Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Packaging

100 Gram Kit
500 Gram Kit

Warranty

6 Months