For applications requiring low viscosity for superior flow and low outgassing and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
Suitable as an adhesive in low-strength applications such as solar cell arrays where clarity and low volatility are important
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
Transparent
Viscosity, Part A
3,000 cP (3,000 mPas)
Work Time
3 hours
Tack Free Time
6 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity
1.02
Tensile Strength
950 psi (6.6 MPa)
Elongation
100%
Collected Volatile Condensable Material (CVCM)
0.01%
Total Mass Loss (TML)
0.04%
Cured: 48 hours at 40°C (104°F)
Durometer, Type A
40
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
