Designed for enhanced performance in extreme low and high temperatures
1:1 Mix Ratio (Part A: Part B)
APPLICATION
For applications requiring low volatility
Useful for potting intricate assemblies due to a low viscosity
As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Transparent
Viscosity*
1,800 cP (1,800 mPas)
Cured: 40 minutes at 150°C (302°F)
Penetration* (GCA Penetrometer, 19.5 g shaft, 6.35 mm diameter, 5 seconds)
3 mm
Volatile Content (1 hour at 275°C)
0.3%
Ionic Content, Cl
<5 ppm
Ionic Content, K
<1 ppm
Ionic Content, Na
<4 pmm
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
