For applications requiring low volatility and high purity
Designed for protection of electrical components and assemblies against shock, vibration, moisture, dust, chemicals, and other environmental hazards
For bonding and sealing in applications such as overhead or vertical joints that require a non-slumping and one-part material
Bonds well to plastics such as polycarbonate
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Translucent
Flow
< 2 inches / 5 minutes
Extrusion Rate (Performed using a SEMCO® 440 nozzle with
a 1/8" orifice and 60 +/- 5 psi air pressure)
30 g/min
Tack Free Time
25 minutes
Cure Time (0.02 or 0.51 mm)
2 hours
Cured: 7 days minimum @ ambient temperature and humidity
Specific Gravity
1.11
Durometer, Type A
35
Tensile Strength
685 psi (4.7 MPa)
Elongation
280%
Dielectric Strength*
1,100 volts/mil (43.3 kV/mm)
Coefficient of Linear Thermal Expansion (CTE)*
Below Tg (-150°C to -115°C)
90 ppm/°C (90µm/m/°C)
Above Tg (-95°C to 250°C)
320 ppm/°C (320µm/m/°C)
Cured: 10 days @ ambient temperature and humidity
Lap Shear Strength (Unprimed)
280 psi (1.9 MPa)
Lap Shear Strength (Primed w/SP-120)
290 psi (2.0 MPa)
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
