For applications requiring a low volatility, conformal, thermally conductive silicone.
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Viscosity, within 15 minutes of catalyzation*
36,000 cP (36,000 mPas)
Viscosity, 2 hours after catalyzation*
50,000 cP (50,000 mPas)
Tack-Free Time*
13 hours
Cured: 15 minutes at 150°C (302°F)
Specific Gravity*
2.34
Durometer, Type A*
65
Tensile Strength*
180 psi (1.2 MPa)
Elongation*
50%
Lap Shear Strength (primed with SP-270)*
120 psi (0.8 MPa)
Thermal Conductivity*
0.95 W/(mK)(23 x 10-4 cal/(cm sec°C))
Volatile Content (1 hr at 275°C)
0.35 %
Volume Resistivity
3.4 X1013
Dielectric Strength
465 V/mil (18.1 kV/mm)
Dielectric Constant, 100 Hz
4.9
Dielectric Constant, 1 kHz
4.9
Dissipation Factor, 100 Hz
0.003
Dissipation Factor, 1 kHz
0.002
Coefficient of Linear Expansion (-70°C to 200°C)
200µm/(m°C)
Glass Transition Temperature (Tg)
-98°C
Ion Content, Na
< 6ppm
Ion Content, K
< 3ppm
Ion Content, Cl
< 5ppm
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Pleasecontact NuSil Technology for assistance and recommendations in establishing particular specifications.
Packaging
50 Gram Kit
200 Gram Kit
500 Gram Kit
Warranty
12 Months
Product Profile
Material Safety Data Sheet EU EN
Example packaging
Biomaterials
Biomaterials - Medical Silicones for Healthcare
Advanced Technologies
Space - Aviation Grade Industrial & Engineering Silicones
Tubing
Food, Medical & Industrial Quality Silicone Tubing
Equipment
Mixing Dispensing & Degassing Equipment for Silicone
Product Profile
