For applications requiring a low volatility, conformal, thermally conductive silicone.
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Viscosity, within 15 minutes of catalyzation*
36,000 cP (36,000 mPas)
Viscosity, 2 hours after catalyzation*
50,000 cP (50,000 mPas)
Tack-Free Time*
13 hours
Cured: 15 minutes at 150°C (302°F)
Specific Gravity*
2.34
Durometer, Type A*
65
Tensile Strength*
180 psi (1.2 MPa)
Elongation*
50%
Lap Shear Strength (primed with SP-270)*
120 psi (0.8 MPa)
Thermal Conductivity*
0.95 W/(mK)(23 x 10-4 cal/(cm sec°C))
Volatile Content (1 hr at 275°C)
0.35 %
Volume Resistivity
3.4 X1013
Dielectric Strength
465 V/mil (18.1 kV/mm)
Dielectric Constant, 100 Hz
4.9
Dielectric Constant, 1 kHz
4.9
Dissipation Factor, 100 Hz
0.003
Dissipation Factor, 1 kHz
0.002
Coefficient of Linear Expansion (-70°C to 200°C)
200µm/(m°C)
Glass Transition Temperature (Tg)
-98°C
Ion Content, Na
< 6ppm
Ion Content, K
< 3ppm
Ion Content, Cl
< 5ppm
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Pleasecontact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
