For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for environmental protection of electronic assemblies and components
Provides protection from humidity, radiation, thermal stress and mechanical stress
As an adhesive in low-strength applications such as solar cell arrays where clarity and low volatility are important
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
Transparent
Viscosity, Part A
8,000 cP (8,000 mPas)
Viscosity, tested 2 hours after catalyzation
9,500 cP (9,500 mPas)
Cured: 15 minutes at 150°C (302°F)
Specific Gravity
1.02
Durometer, Type A
45
Tensile Strength
950 psi (6.6 MPa)
Elongation
125%
Collected Volatile Condensable Material (CVCM)
0.004%
Total Mass Loss (TML)
0.06%
Cured: 4 hours at 60°C (140°F)
Lap Shear Strength (primed w/ CF1-135)
375 psi (2.6 MPa)
The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
