For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
Suitable as an adhesive in applications such as solar cell arrays where clarity and low volatility are important
For applications requiring a low viscosity for superior flow
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Transparent
Viscosity, Part A*
3,800 cP (3,800 mPas)
Viscosity, Part B*
2,800 cP (2,800 mPas)
Work Time*
4 hours
Cured: 15 minutes at 150°C (302°F)
Specific Gravity*
1.02
Durometer, Type A*
50
Tensile Strength*
925 psi (6.4 MPa)
Elongation*
90%
Lap Shear Strength* (primed w/ CF1-135)
175 psi (1.2 MPa)
Coefficient of Linear Thermal Expansion, above Tg(-80°C to 250°C)
400 ppm/°C (400µm/m/°C)
Extractable Ionics
Below MIL-STD-883E
Collected Volatile Condensable Material (CVCM)*
0.004%
Total Mass Loss (TML)*
0.04%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
