For applications requiring Ultra Low OutgassingTM and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
Use for RFI and EMI shielding in electrical and space applications
Well suited for form-in-place conductive gaskets
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Tan
Work Time*
2.5 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity*
3.42
Durometer, Type A*
85
Tensile Strength*
450 psi (3.1 MPa)
Volume Resistivity*
0.005 ohm cm
Thermal Conductivity
1.20 W/(mK)(29 x 10-4 cal/(cm sec°C))
Coefficient of Linear Thermal Expansion
Below Tg (-100°C to -50°C)
140 ppm/°C (140 µm/m/°C)
Above Tg (-30°C to 250°C)
215 ppm/°C (215 µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.004%
Total Mass Loss (TML)*
0.01%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
