For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for environmental protection of electronic assemblies and components
Provides protection from extremes in temperature, humidity, radiation, thermal stress and mechanical stress
Low viscosity for applications requiring superior flow
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Transparent
Viscosity, Part A*
3,500 cP (3,500 mPas)
Viscosity, tested 2 hours after catalyzation*
6,500 cP (6,500 mPas)
Cured: 4 hours at 65°C (149°F)
Specific Gravity*
1.04
Durometer, Type A*
45
Tensile Strength*
475 psi (3.3 MPa)
Elongation*
85%
Lap Shear Strength* (primed w/CF1-135)
250 psi (1.7 MPa)
Refractive Index
1.43
Coefficient of Linear Expansion
Below Tg (-150°C to -115°C)
10 ppm/°C (10µm/m/°C)
Above Tg (-95°C to 250°C)
490 ppm/°C (490µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.008%
Total Mass Loss (TML)*
0.05%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
