For applications requiring extreme low temperature, low outgassing and minimal volatile condensables under extreme operating conditions
As a sealing, caulking, adhesive or potting material in electronics and space applications requiring minimal outgassing to avoid condensation in sensitive devices
For bonding and sealing in applications such as overhead or vertical joints that require a non-slumping and one-part material
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Translucent
Extrusion Rate* (Performed using a SEMCO® 440 nozzle with a1/8" orifice and 60 ± 5 psi air pressure)
35 g/min
Tack Free Time*
20 minutes
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity*
1.11
Durometer, Type A*
45
Tensile Strength*
700 psi (4.8 MPa)
Elongation*
300%
Young's Modulus
250 psi (1.7 MPa)
Dielectric Strength
1,100 volts/mil (43.3 kV/mm)
Coefficient of Linear Thermal Expansion (CTE)
Below Tg (-150°C to -115°C)
90 ppm/°C (90 um/m/°C)
Above Tg (-95°C to 250°C)
320 ppm/°C (320 um/m/°C)
Dynamic Mechanical Analysis (DMA)
See Profile PDF for Graph
Collected Volatile Condensable Material (CVCM)*
0.04%
Total Mass Loss (TML)*
0.46%
Cured: 10 days at ambient temp. and humidity
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
