Designed for enhanced performance in extreme low and high temperatures
APPLICATION
For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
To provide moderate heat transfer between electrical/electronic components and their heat sinks
As a sealing, caulking, adhesive or potting material in electronics and space applications requiring minimal outgassing to avoid condensation in sensitive devices
For bonding and sealing in applications such as overhead or vertical joints that require a non-slumping and one-part material
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Cure Loss
3.2%
Extrusion Rate* (Performed using a 14 gauge nozzle with a 0.5" orifice and 90 ± 5 psi air pressure)
40 g/min
Tack-Free Time*
40 minutes
Cured: 72 hours minimum at ambient temp. and humidity
Appearance*
Elastomeric Solid
Specific Gravity*
2.33
Durometer, Type A*
65
Tensile Strength*
400 psi (2.8 MPa)
Elongation*
150%
Thermal Conductivity*
0.609 W/(mK)
Coefficient of Linear Thermal Expansion (-115°C to 250°C)
223 ppm/°C (223µm/m/°C)
Glass Transition (Tg)
-116°C (-177°F)
Ionic Content, Cl
<5 ppm
Ionic Content, K
<5 ppm
Ionic Content, Na
<5 ppm
Collected Volatile Condensable Material (CVCM)*
0.02%
Total Mass Loss (TML)*
0.14%
Cured: 7 days at ambient temp. and humidity
Lap Shear Strength (unprimed)*
225 psi (1.6 MPa)
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
