For use as a thermally conductive adhesive and potting compound
To provide heat transfer between electrical/electronic components and their heat sinks
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
White
Flow Rate, Part A
0.3 inches
Work Time
5 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity
1.55
Durometer, Type A
85
Tensile Strength
280 psi (1.9 MPa)
Elongation
19%
Thermal Conductivity
2.06 W/(m K)(49 x 10-4 cal/(cm sec°C))
Tissue Culture (Cytotoxicity Testing)
Pass
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
