Two-part, white, thermally conductive adhesive and potting compound
Cures with heat via addition-cure chemistry
Designed to allow bond line thicknesses ≥ 50 microns
20:1 Mix Ratio (Part A: Part B)
APPLICATION
For use as a thermally conductive adhesive and potting compound
To provide heat transfer between electrical/electronic components and their heat sinks
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
White
Work Time
2 hours
Cured: 30 minutes at 150°C (302°F)
Durometer, Type A
75
Tensile Strength
580 psi (4.0 MPa)
Elongation
125%
Tear Strength
67 ppi (11.8 kN/m)
Thermal Conductivity
0.610 W/(m K)(15 x 10-4 cal/(cm sec °C))
Tissue Culture (Cytotoxicity Testing)
Pass
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
