For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide moderate heat transfer between electrical/electronic components and their heat sinks
Use to adhere openings in modules or housings where grooves and other configurations require a non-flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Gray
Work Time*
2.5 hours
Tack-Free Time*
4.0 hours
Cured: 24 hours minimum at ambient temp. and humidity, then 15 minutes at 150°C (302°F)
Specific Gravity*
2.4
Durometer, Type A*
85
Tensile Strength*
650 psi (4.5 MPa)
Elongation*
15%
Tear Strength*
55 ppi (9.70 kN/m)
Lap Shear Strength* (primed w/ CF1-135)
375 psi (2.6 MPa)
Thermal Conductivity*
0.999 W/(mK)(24 x 10-4 cal/(cm sec°C))
Dielectric Strength
430 volts/mil (16.9 kV/mm)
Volume Resistivity
1.4 x 1014 ohm cm
TGA Take-Off (1% wt. Loss, 10°C/min. in air)
330°C (626°F)
Coefficient of Linear Thermal Expansion
Below Tg (-100°C to -50°C)
130 ppm/°C (130µm/m/°C)
Above Tg (-30°C to 250°C)
185 ppm/°C (185µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.09%
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
