For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Work Time*
2 hours
Tack-Free Time*
4.5 hours
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity*
1.53
Durometer, Type A*
75
Tensile Strength*
200 psi (1.38 MPa)
Elongation*
30%
Tear Strength*
50 ppi (8.8 kN/m)
Lap Shear Strength* (primed w/ CF1-135)
160 psi (1.1 MPa)
Young's Modulus
3,000 psi (20.7 MPa)
Thermal Conductivity* (Tested at 43°C (109°F))
1.49 W/(mK)(36 x 10-4 cal/(cm sec°C))
Dielectric Strength
540 volts/mil (21.3 kV/mm)
Volume Resistivity
5.3 x 1014 ohm cm
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.05%
Cured: 2 hours at 65°C (149°F)
Durometer, Type A
85
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
