Polymer Systems
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Advanced Engineering



Thermally Conductive

Thermally Conductive Controlled Volatility Silicone

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • 15:1 Mix Ratio (Part A:B)
  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
Typical PropertiesAverage Result
Work Time*2 hours
Tack-Free Time*4.5 hours
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity*1.53
Durometer, Type A*75
Tensile Strength*200 psi (1.38 MPa)
Tear Strength*50 ppi (8.8 kN/m)
Lap Shear Strength* (primed w/ CF1-135)160 psi (1.1 MPa)
Young's Modulus3,000 psi (20.7 MPa)
Thermal Conductivity* (Tested at 43°C (109°F))1.49 W/(mK)(36 x 10-4 cal/(cm sec°C))
Dielectric Strength540 volts/mil (21.3 kV/mm)
Volume Resistivity5.3 x 1014 ohm cm
Collected Volatile Condensable Material (CVCM)*0.01%
Total Mass Loss (TML)*0.05%
Cured: 2 hours at 65°C (149°F)
Durometer, Type A85

*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Recommended Primer CF1-135

Note: Some bonding applications may require the use of a primer.


50 Gram Kit
100 Gram Kit
250 Gram Kit
500 Gram Kit


12 Months

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