For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
Use a bonding, sealing, or potting material in electronic and space applications
Provides radiation resistance, low thermal conductivity, oxidation stability, thermal stability and good ablative characteristics
Especially useful to bond solar cells to solar array panels
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Uncured:
Appearance, Part A*
Red
Appearance, Part B*
White
Viscosity, Part A*
125,000 cP (125,000 mPas)
Viscosity, Part B*
80,000 cP (80,000 mPas)
Work Time*
3 hours
Cured: 30 minute at 150°C (302°F)
Specific Gravity*
0.76
Durometer, Type A*
40
Tensile Strength*
235 psi (1.6 MPa)
Elongation*
170%
Lap Shear Strength* (primed w/ CF1-135)
175 psi (1.2 MPa)
Coefficient of Linear Expansion
Below Tg (-150°C to -115°C)
55 ppm/°C (55 um/m/°C)
Above Tg (-95°C to 250°C)
245 ppm/°C (245 um/m/°C)
Dielectric Strength
860 volts/mil (33.9 kV/mm)
Collected Volatile Condensable Material (CVCM)*
0.03%
Total Mass Loss (TML)*
0.37%
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
