For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
Use to adhere covers onto housings or for any application where grooves and other configurations require a material with superior flow
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Transparent
Viscosity, Mixed*
2,600 cP (2,600 mPas)
Cured: 1 hour at 65°C (149°F)
Specific Gravity*
1.01
Durometer, Type A*
30
Tensile Strength*
425 psi (2.9 MPa)
Elongation*
150%
Moisture Absorption, % gain after 168 hours at 85°C, 85%R.H.
0.16%
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.26%
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
