For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
Suitable as an adhesive in applications such as solar cell arrays where clarity and low volatility are important
For applications requiring a low viscosity for superior flow
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
Transparent
Viscosity, Part A*
3,750 cP (3,750 mPas)
Viscosity, Part B*
2,700 cP (2,700 mPas)
Work Time*
3 hours
Tack-Free Time*
6 hours
Cured: 15 minutes at 150°C (302°F)
Specific Gravity*
1.02
Durometer, Type A*
50
Tensile Strength*
850 psi (5.9 MPa)
Elongation*
90%
Lap Shear Strength* (primed w/ CF1-135)
225 psi (1.6 MPa)
Coefficient of Linear Thermal Expansion, above Tg (-80°C to 250°C)
400 ppm/°C (400 um/m/°C)
Extractable Ionics
Below MIL-STD-883E
Moisture Absorption, % gain after 168 hour exposure at 85°C (185°F) / 85% R.H.
0.11%
Dynamic Mechanical Analysis (DMA)
See Profile PDF Fpr Graph
Collected Volatile Condensable Material (CVCM)*
0.01%
Total Mass Loss (TML)*
0.05%
After High Temperature Exposure: 7 days at 240°C (464°F)
Lap Shear Strength (primed w/ SP-270)
55 psi (0.39 MPa)
10 cycles of 5 minutes at 300°C (572°F)
Tensile Strength
175 psi (1.2 MPa)
Elongation
70%
Young's Modulus
480 psi (3.3 MPa)
Lap Shear Strength (primed w/ SP-270)
300 psi (2.1 MPa)
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
