Designed to allow bond line thicknesses ≤ 50 micron to reduce thermal resistance
20:1 Mix Ratio (Part A: Part B)
APPLICATION
For applications requiring low volatility under extreme operating conditions to avoid contamination in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks while remaining electrically insulating
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Extrusion Rate, Part A* (Performed using a SEMCO® 440 nozzlewith an 1/8" orifice and 90 ±5 psi)
140 g/min
Work Time*
3 hours
Cured: 30 minutes at 150°C (302°F)
Durometer, Type A*
55
Tensile Strength*
400 psi (2.75 MPa)
Elongation*
225%
Tear Strength*
55 ppi (9.7 kN/m)
Thermal Conductivity*
0.64 W/(mK)(15 x 10-4cal/(cm sec°C))
Volatile Content (1 hour at 275°C)
0.03%
Ionic Content, Cl
< 6 ppm
Ionic Content, K
< 3 ppm
Ionic Content, Na
< 3 ppm
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
