Polymer Systems
Technology Limited

Advanced Engineering

DESCRIPTION

APPLICATION

For protection of sensitive photonics assemblies from mechanical shock, thermal shock, dust, and ambient atmosphere
As an embedding or potting compound for environmental protection of electronic assemblies and components, such as LEDs
For applications requiring low outgassing and minimal volatile components to avoid contamination in sensitive devices
Extended work time allows voids in complex assemblies to fill in and permits time for any trapped air bubbles to float to the fluid surface and escape
UV and heat resistant
Handles stress during thermal cycling without cracking or delaminating
For applications requiring an operating temperature range of-65°C to 240°C (-85°F to 464°F)

PROPERTIES
Typical Properties	Result	Metric Conv.
Uncured:
Appearance	Transparent	-
Viscosity, Part A	16,000 cP	16,000 mPas
Viscosity, Part B	8,500 cP	8,500 mPas
Work Time (<2x viscosity)	24 hours minimum	-
Volume Resistivity, Part A	1 x 10¹⁴ ohm cm minimum	-
Volume Resistivity, Part B	1 x 10¹⁴ ohm cm minimum	-
UV/Visible Spectrophotometry at 400 nm, 1 cm path length	90 %T minimum	-
Refractive Index	1.4	-
Cured: 30 minutes at 150°C (302°F)
Penetration‡	0.4 mm	-
Dielectric Strength	350 V/mil	13.8 kV/mm
Weight Loss (1 hr at 275°C)	0.8%	-
Moisture Absorption, % gain after 168 hour exposure	0.20 %	-
at 85°C (185°F) / 85% R.H. Ionic Content, Cl	< 5ppm	-
Ionic Content, K	< 1ppm	-
Ionic Content, Na	< 2 ppm	-
Glass Transition (Tg)	-126°C	-
Coefficient of Linear Thermal Expansion (0°C to 260°C)	411 ppm/°C	411µm/m/°C
Refractive Index vs. Temperature, 589 nm	-3.85 x 10^-4 /°C	-
Refractive Index vs. Wavelength	See Profile PDF for Graph	-
Optical Absorption vs. Wavelength	See Profile PDF for Graph	-
Optical Transmission vs. Wavelength, after UV exposure	See Profile PDF for Graph	-
Optical Transmission vs. Wavelength, after 12 days at 150°C	See Profile PDF for Graph	-