For potting, encapsulating and coating of modules, relays, and a variety of AC/DC converters including high power and planar packages
Provides protection from moisture, dust and contaminants
Increases resistance to shock and vibration
Low viscosity allows the potting of complex geometries without the entrapment of air
Pot life is compatible with processes that require dispensing or coating with Part A and B combined
Dielectric properties compatible with many devices and increase breakdown voltage of device
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance, Part A
Translucent
Appearance, Part B
Translucent
Viscosity, Part A
13,000 cP
Viscosity, Part B
9,000 cP
Work Time (Pot Life)
8 hour minimum
Cured: 30 minutes at 150 °C (302°F)
Durometer, Type A
20
Tensile Strength
475 psi (3.3 MPa)
Elongation
350 %
Tested per UL-94 *
Passed V-1
Dielectric Constant, 100 Hz*
2.9
Dielectric Constant, 100 kHz*
2.6
Dissipation Factor, 100 Hz*
0.0001
Dissipation Factor, 100 kHz*
0.0001
Dielectric Strength *
500 Volts/mil (19.5 kV/mm)
Ionic Content, Cl*
> 5 ppm
Ionic Content, K*
>3 ppm
Ionic Content, Na*
> 1 ppm
Thermal Gravimetric Analysis (TGA)*,
---
Weight loss 30°C to 380°C
5%
Weight loss 30°C to 750°C
60%
Glass Transition Temperature (Tg)*
-45°C
Coefficient of Thermal Expansion (-25°C to 250°C)*
320 µm/m°C
Moisture Absorption, % gain after 168 hour exposure*
0.2%
at 85°C (185°F) / 85% R.H.
---
% Linear Shrink (1 hour at 100°C)*
2.5%
% Linear Shrink (1 hour at 150°C)*
3.8%
Recommended Cure Times based on 90% cured via ODR†
Cure time at 70°C
4 hours
Cure time at 100°C
30 minutes
Cure time at 150°C
20 minutes
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
†Recommended cure times are based on the testing performed via ODR (Oscillating Disk Rheometer). However the cure times can be affected by multiple factors, including, but not limited to, quantity of silicone used, time to heat the entire device or mold, and whether the material is cured in pre-heated oven or not.
Product Profile
