To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere openings in modules and housings where grooves or other configurations require a limited flow material with moderate thermal conductivity
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Viscosity, Part A*
70,000 cP (70,000 mPas)
Work Time*
4 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity*
1.34
Durometer, Type A*
70
Tensile Strength*
300 psi (2.1 MPa)
Elongation*
70%
Tear Strength*
45 ppi (7.9 kN/m)
Thermal Conductivity*
0.75 W/(mK)(18 x 10-4 cal/(cm sec°C))
Dielectric Strength
810 Volts/mil (31.9 kV/mm)
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
