For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
As an embedding or potting compound for environmental protection of electronic assemblies and components
Provides protection from extremes in temperature, humidity, radiation, thermal stress and mechanical stress
As an adhesive in optical applications requiring a black material to block light
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance, Part A*
Black
Appearance, Part B*
Transparent
Viscosity*
9,500 cP (9,500 mPas)
Work Time*
4.5 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity*
1.06
Durometer, Type A*
50
Tensile Strength*
950 psi (6.6 MPa)
Elongation*
150%
Coefficient of Linear Thermal Expansion
Below Tg (-100° to -50°C)
360 ppm/°C (360 µm/m/°C)
Above Tg (-30°C to 250°C)
370 ppm/°C (370 µm/m/°C)
Dielectric Strength
850 Volts/mil (33.5 kV/mm)
Collected Volatile Condensable Material (CVCM)*
0.007%
Total Mass Loss (TML)*
0.05%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
