For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Work Time*
2 hours
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity*
1.53
Durometer, Type A*
75
Tensile Strength*
200 psi (1.4 MPa)
Elongation*
30%
Tear Strength*
50 ppi (8.8 kN/m)
Lap Shear Strength* (primed w/ CF1-135)
150 psi (1.0 MPa)
Thermal Conductivity* (tested @ 43°C (109°F))
1.60 W/mK(38 x 10-4 cal/(cm sec°C))
Dielectric Strength
540 volts/mil (21.3 kV/mm)
Volume Resistivity
5.3 x 1014 ohm cm
TGA Take-Off (1% wt. Loss, 10°C/min. in air)
350°C (662°F)
Coefficient of Linear Thermal Expansion
Below Tg (-100°C to -50°C)
165 ppm/°C (165 µm/m/°C)
Above Tg (-30°C to 250°C)
225 ppm/°C (225 µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.007%
Total Mass Loss (TML)*
0.05%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Packaging
50 Gram Kit
100 Gram Kit
500 Gram Kit
Warranty
12 Months
Product Profile
Material Safety Data Sheet EU EN
Biomaterials
Biomaterials - Medical Silicones for Healthcare
Advanced Technologies
Space - Aviation Grade Industrial & Engineering Silicones
Tubing
Food, Medical & Industrial Quality Silicone Tubing
Equipment
Mixing Dispensing & Degassing Equipment for Silicone
Product Profile
