For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance*
White
Work Time*
2 hours
Cured: 7 days minimum at ambient temp. and humidity
Specific Gravity*
1.53
Durometer, Type A*
75
Tensile Strength*
200 psi (1.4 MPa)
Elongation*
30%
Tear Strength*
50 ppi (8.8 kN/m)
Lap Shear Strength* (primed w/ CF1-135)
150 psi (1.0 MPa)
Thermal Conductivity* (tested @ 43°C (109°F))
1.60 W/mK(38 x 10-4 cal/(cm sec°C))
Dielectric Strength
540 volts/mil (21.3 kV/mm)
Volume Resistivity
5.3 x 1014 ohm cm
TGA Take-Off (1% wt. Loss, 10°C/min. in air)
350°C (662°F)
Coefficient of Linear Thermal Expansion
Below Tg (-100°C to -50°C)
165 ppm/°C (165 µm/m/°C)
Above Tg (-30°C to 250°C)
225 ppm/°C (225 µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.007%
Total Mass Loss (TML)*
0.05%
*The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
