Designed for enhanced performance in extreme low and high temperatures
APPLICATION
For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide moderate heat transfer between electrical/electronic components and their heat sinks
Use for adhering openings in modules and housings where grooves or other configurations require a limited flow material
For applications requiring a broader operating temperature range
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance, Part A*
White
Viscosity, Part A*
300,000 cP (300,000 mPas)
Work Time*
2 hours
Cured: 30 minutes at 150°C (302°F)
Specific Gravity*
1.38
Durometer, Type A*
75
Tensile Strength*
275 psi (1.9 MPa)
Elongation*
40%
Tear Strength*
45 ppi (7.9 kN/m)
Lap Shear Strength (primed w/ CF1-135)
205 psi (1.4 MPa)
Thermal Conductivity*
0.791 W/(mK)(19 x 10-4 cal/(cm sec°C))
Coefficient of Linear Thermal Expansion
Below Tg (-150 to -115°C)
65 ppm/°C (65µm/m/°C)
Above Tg (-95 to 250°C)
275 ppm/°C (275µm/m/°C)
Collected Volatile Condensable Material (CVCM)*
0.00%
Total Mass Loss (TML)*
0.03%
*Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
