Two-part, white, thermally conductive silicone gel
Cures with the addition of heat
20:1 Mix Ratio (Part A:Part B)
APPLICATION
For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
TYPICAL PROPERTIES
AVERAGE RESULT
Uncured:
Appearance
White
Work Time
5.5 hours
Extrusion Rate
122 gm/min
Tack-Free Time
16.5 hours
Cured: 72 hours minimum at ambient temp. and humidity
Elongation
1.30
Durometer, Type 00
36
Lap Shear Strength* (primed w/ SP-120)
27 psi (1.1 MPa)
Thermal Conductivity
0.95 W/(mK)(x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
0.01%
Total Mass Loss (TML)
0.05%
Properties tested on a lot-to-lot basis. Do not use the properties shown in this technical profile as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
