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SCV2-2599

Thermally Conductive

Ultra Low Outgassing™ Thixotropic Thermally Conductive Silicone

DESCRIPTION
  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses ≤ 50 microns
  • 20:1 Mix Ratio (Part A:Part B)
APPLICATION
  • For applications highly sensitive to outgas related contamination
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical PropertiesAverage Result
Uncured:
AppearanceWhite
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)140 g/min
Work Time3 hours
Cured: 30 minutes ay 150°C (302°F)
Durometer, Type A55
Tensile Strength400 psi (2.8 MPa)
Elongation225%
Tear Strength55 ppi (9.7 kN/m)
Thermal Conductivity0.644 W/mK (15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)≤0.010%
Total Mass Loss (TML)≤0.1%

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Packaging

50 Gram Kit
100 Gram Kit
500 Gram Kit

Warranty

12 Months

Product Profile - Full Details Product Profile
Material Safety Data Sheet EU EN Material Safety Data Sheet

Biomaterials

Medical Silicones
Biomaterials - Medical Silicones for Healthcare

Advanced Technologies

Advanced Technologies Industrial & Engineering Silicones
Space - Aviation Grade Industrial & Engineering Silicones

Tubing

Food Medical Industrial Grade Silicone Tubing
Food, Medical & Industrial Quality Silicone Tubing

Equipment

Silicone Mixing Dispensing Degassing Equipment
Mixing Dispensing & Degassing Equipment for Silicone