Designed to allow bond line thicknesses ≤ 50 microns
20:1 Mix Ratio (Part A:Part B)
APPLICATION
For applications highly sensitive to outgas related contamination
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
White
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)
140 g/min
Work Time
3 hours
Cured: 30 minutes ay 150°C (302°F)
Durometer, Type A
55
Tensile Strength
400 psi (2.8 MPa)
Elongation
225%
Tear Strength
55 ppi (9.7 kN/m)
Thermal Conductivity
0.644 W/mK (15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
≤0.010%
Total Mass Loss (TML)
≤0.1%
The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Packaging
50 Gram Kit
100 Gram Kit
500 Gram Kit
Warranty
12 Months
Product Profile
Material Safety Data Sheet EU EN
Biomaterials
Biomaterials - Medical Silicones for Healthcare
Advanced Technologies
Space - Aviation Grade Industrial & Engineering Silicones
Tubing
Food, Medical & Industrial Quality Silicone Tubing
Equipment
Mixing Dispensing & Degassing Equipment for Silicone
Product Profile
