Designed to allow bond line thicknesses ≤ 50 microns
20:1 Mix Ratio (Part A:Part B)
APPLICATION
For applications highly sensitive to outgas related contamination
To provide heat transfer between electrical/electronic components and their heat sinks
Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical Properties
Average Result
Uncured:
Appearance
White
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)
140 g/min
Work Time
3 hours
Cured: 30 minutes ay 150°C (302°F)
Durometer, Type A
55
Tensile Strength
400 psi (2.8 MPa)
Elongation
225%
Tear Strength
55 ppi (9.7 kN/m)
Thermal Conductivity
0.644 W/mK (15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)
≤0.010%
Total Mass Loss (TML)
≤0.1%
The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
Product Profile
