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SCV2-2599

Thermally Conductive

Ultra Low Outgassing™ Thixotropic Thermally Conductive Silicone

DESCRIPTION
  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses ≤ 50 microns
  • 20:1 Mix Ratio (Part A:Part B)
APPLICATION
  • For applications highly sensitive to outgas related contamination
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
PROPERTIES
Typical PropertiesAverage Result
Uncured:
AppearanceWhite
Extrusion Rate, Part A (Performed using a SEMCO® 440 nozzle with an 1/8" orifice and 90 ±5 psi air pressure)140 g/min
Work Time3 hours
Cured: 30 minutes ay 150°C (302°F)
Durometer, Type A55
Tensile Strength400 psi (2.8 MPa)
Elongation225%
Tear Strength55 ppi (9.7 kN/m)
Thermal Conductivity0.644 W/mK (15 x 10-4 cal/(cm sec°C))
Collected Volatile Condensable Material (CVCM)≤0.010%
Total Mass Loss (TML)≤0.1%

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Recommended Primer CF1-135

Note: Some bonding applications may require the use of a primer.

Packaging

50 Gram Kit
100 Gram Kit
500 Gram Kit

Warranty

12 Months

Product Profile - Full Details Product Profile
Material Safety Data Sheet EU EN Material Safety Data Sheet

Biomaterials

Medical Silicones
Biomaterials - Medical Silicones for Healthcare

Advanced Technologies

Advanced Technologies Industrial & Engineering Silicones
Space - Aviation Grade Industrial & Engineering Silicones

Tubing

Food Medical Industrial Grade Silicone Tubing
Food, Medical & Industrial Quality Silicone Tubing

Equipment

Silicone Mixing Dispensing Degassing Equipment
Mixing Dispensing & Degassing Equipment for Silicone