Polymer Systems
Technology Limited

Advanced Engineering

Optoelectronics:
Electronics:

R-2165

Potting and Encapsulating Elastomers

Thermally Conductive Silicone Potting Elastomer

DESCRIPTION

Two part, Gray, 1:1 Mix ratio (A:B)
Pourable and self-leveling
Cures at room temperature

APPLICATION

Enhanced thermal conductivity for removal of heat and improved reliability
Low viscosity allows the potting of complex geometries without the entrapment of air
Quick set-up and flexible cure schedule
Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions

PROPERTIES
Typical Properties	Average Result
Uncured:
Appearance, Part A*	Gray
Appearance, Part B*	Off White
Appearance, Mixed	Gray
Viscosity, Part A	4,800 cP
Viscosity, Part B	3,200 cP
Work Time	10 minute minimum
Cured: 10 minutes at 150°C (302°F)
Durometer, Type A	60
Tensile Strength	500 psi ( 3.4 MPa)
Elongation	100%
Volume Resistivity*	1.0 x 10¹⁵ Ohm cm
Thermal Conductivity	0.50 W/mK
Dielectric Constant, 100 Hz*	3.6
Dielectric Constant, 100 kHz*	3.2
Dielectric Strength*	700 Volts/mil (27.3 kV/mm)
Glass Transition Temperature (Tg)*	-48°C
Coefficient of Thermal Expansion (-140°C to -70°C)*	110 µm/m°C
Coefficient of Thermal Expansion (-30°C to 120°C)*	230 µm/m°C
Cured: 24 hours minimum at ambient temperature and humidity
Durometer, Type A	60

*These properties NOT tested on a lot-to-lot basis. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Packaging

50 mL Side-by-Side Kit
200 mL Side-by-Side Kit
2 Pint Kit (910 g)
2 Gallon Kit (7.28 kg)
10 Gallon Kit (36.4 kg)

Warranty

6 Months